• Ep21tdcslonl1 10728231

    Master Bond EP21TDCS-LO surpasses the existing performance parameters of commercially available, electrically conductive adhesive formulations. This compound has extremely high toughness, high peel strength and exceptionally low volume resistivity. It cures at room temperature and has a convenient one to one mix ratio by weight or volume. EP21TDCS-LO passes NASA low outgassing requirements and is cryogenically serviceable.  It has a service operating temperature range of 4 K to 275 degrees F.

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