AMETEK Expands Electronic Components & Packaging Division

Feb. 8, 2017
Electronic Components & Packaging (ECP) brings together brands into a single global business platform.

MONTVALE, NJ – AMETEK, Inc. has combined its industry-leading electronic components, packaging, interconnect and wire businesses into an expanded division, Electronic Components & Packaging (ECP), that brings together its market-leading Aegis, Coining, Glasseal, Hermetic Seal, SCP and Sealtron brands into a single global business platform.

“The new ECP division leverages the manufacturing, engineering, sales and marketing resources of our existing electronic packaging and interconnects businesses, while increasing our product offerings that also include components, wire, metal preform, custom alloy, and both metal and ceramic covers. It allows us to provide our expanding customer base with a growing range of innovative component and hermetic solutions,” comments Greg Nelson, Vice President and General Manager of AMETEK ECP.

“With our new business structure, we are better able to offer our customers greater options for solving their most-challenging engineering problems. Our customers look to us for help extending product life and performance in some of the harshest environments, both on and off the planet,” he adds.

“In addition, high reliability and performance doesn’t stop with the components and packaging. AMETEK ECP also provides the best-in-class interconnects required by our customers for more complete electronics solutions.”

For more information, visit www.ametek-ecp.com.