We offer an extensive variety of high-performance adhesives, sealants, coatings, potting, and encapsulation compounds for aerospace and defense electronic applications. Technologically advanced formulations are designed to withstand high and low-temperature exposure, vibration, impact, chemicals, and thermal cycling.
This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft requiring stringent Airbus specifications be satisfied. It is...
EP29LPSP is a two-component, low viscosity epoxy system for bonding, sealing and coating. This epoxy not only functions at temperatures as low as 4K, but also withstands cryogenic...
Master Bond’s Supreme 10AOHT-LO features high peel and shear strengths, superior electrical insulation properties and a thermal conductivity of 10 BTU/in/ft²/hr/°F. It has a service...
Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior ...
Master Bond EP21TDCS-LO surpasses the existing performance parameters of commercially available, electrically conductive adhesive formulations. This compound has extremely high...
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