GE Introduces First Industrial microCT Scanner with Breakthrough scatter|correct Technology

Dec. 2, 2015
The scatter|correct technology enhances defect detection and analysis as well as 3D metrology in the automotive, aerospace and power generation sectors

Wunstorf, Germany — The unique scatter|correct technology from GE Measurement & Control is now exclusively available for industrial microCT users of GE’s phoenix v|tome|x m CT system. It provides significant CT data quality improvements for high energy microfocus CT scans with up to 300 kV. The scatter|correct technology enhances defect detection and analysis as well as 3D metrology in the automotive, aerospace and power generation sectors and can especially be applied to high scattering materials, such as steel and aluminum, composites, and multi-material samples.

GE’s proprietary scatter|correct technology, a combination of hardware and software advances driving performance improvements, is now available for the v|tome|x m system. This technological advancement automatically removes scatter artifacts from the CT volume, allowing users to gain a low scatter artifact quality level never before reached with conventional cone beam microCT. Process control productivity on the production floor is increased by clearly improved quantitative volume evaluations, such as automatic defect recognition (ADR) or more precise 3D metrology results.

“GE’s breakthrough scatter|correct innovation really changes the limitations of industrial CT. Until now, CT manufacturers had to increase the X-ray energies to minimize the negative scatter radiation quality impact,” said Dr. Oliver Brunke, senior CT product manager at GE Measurement & Control. “But this led to more complex, heavier shielded and expensive systems. With scatter|correct, CT users can now perform in many cases scans normally requiring a 450 kV X-ray tube with a 300 kV X-ray tube by using the available tube spectrum much more effectively.” 

The phoenix v|tome|x m is a versatile X-ray microfocus CT system with optional high resolution nanoCT® capability for 3D metrology and failure analysis with up to 300 kV / 500 W. Beyond down to < 1 µm detail detectability, the system offers industry leading magnification and power at 300 kV. GE’s click & measure|CT acquisition, reconstruction and evaluation automation functionality make it an efficient and reproducible 3D evaluation tool. The phoenix v|tome|x m system is also available as a metrology edition for highly precise and reproducible 3D metrology. The optional dual tube configuration enables high resolution nanoCT®of low absorbing samples. This versatility also ensures the new system a wide spectrum of applications also in materials science.